Warp Solution to Debut AI-Powered Wireless Charging Platform at CES 2026, Promising Multi-Device Efficiency

January 2, 2026
Warp Solution to Debut AI-Powered Wireless Charging Platform at CES 2026, Promising Multi-Device Efficiency
  • Key executives include CEO Kyunghak Lee, and the company’s press materials are distributed via EIN Presswire with AVING News providing coverage.

  • The MFMC (multi-frequency, multi-charging) architecture ensures stable power delivery even when several devices are connected at once.

  • Warp Solution has been a fabless RF wireless power transfer developer since 2016, commercializing ultra-compact power amplifier chips and high-efficiency rectifiers for remote charging.

  • Warp Solution announced at CES 2026 that it will unveil an AI tracking and beamforming-based wireless power transfer platform designed to charge multiple devices simultaneously, leveraging AI vision for adaptive beamforming.

  • The platform operates across a wide frequency range from 100 MHz to 6 GHz and uses proprietary RF-to-DC rectifier chips in the WEP series (WEP1, WEP3, WEPS) to achieve up to 60 percent power conversion efficiency with multiple receivers.

  • Warp Solution’s technology portfolio combines RF energy platforms with AI-powered power control solutions, reflecting more than a decade of R&D.

  • The platform is aimed at IoT, smart homes, industrial automation, and healthcare environments, broadening from RF energy platforms to AI-based power control solutions.

Summary based on 6 sources


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