At CFMS 2026, TWSC highlighted its Full-Stack AI+ Storage Solutions, underscoring a system-wide approach that integrates hardware, firmware, and algorithms to optimize AI workloads.

Manufacturing and testing capabilities are expanding at the Guangming Intelligent Manufacturing Base, featuring automated production, digital control, and multi-dimensional validation to ensure performance, reliability, and compatibility for large-scale AI storage delivery.

Their edge offerings emphasize compatibility with domestic SoCs like UNISOC and Rockchip, targeting diverse scenarios from AI PCs and HPC to content creation and industrial applications, with wide temperature tolerance and high reliability.

Edge AI solutions focus on embedded storage—eMMC, UFS, and LPDDR series—using QLC NAND and compact packaging, with LPDDR5/5X speeds up to 8533Mbps to balance bandwidth and power, validated on domestic platforms.

Looking ahead, TWSC aims to deepen storage technology development and pursue stronger system-level synergy across data centers, edge devices, and diverse industries to unlock new AI-era storage value.

TWSC showcases PCIe 5.0 SSDs and CKD-based DDR5 memory for a range of applications, including AI PCs, HPC, content creation, and industrial use, featuring a dual 32-bit channel design for higher bandwidth.

TWSC is building a full-stack AI data center and edge storage strategy centered on a self-developed enterprise SSD controller, firmware optimization, and mass-produced in-house manufacturing to enable stable, large-scale AI training, inference, and data processing.