Imec Unveils Ultra-Thin Superconducting Wires for Next-Gen High-Performance Computing

September 8, 2026
Imec Unveils Ultra-Thin Superconducting Wires for Next-Gen High-Performance Computing
  • Imec demonstrated superconducting wires as narrow as 30 nanometers using NbTiN, about ten times thinner than traditional Nb-based wires, enabling more connections in the same area.

  • The technology could deliver higher computing density and bandwidth, while reducing data movement energy, with potential use in high-performance computing, data centers, quantum computing, photonics, and neuromorphic systems.

  • The approach is compatible with 300mm semiconductor processes and explores 2.5D/3D integration, easing adoption within existing fabrication ecosystems and enabling larger, more complex circuits.

  • Flexible design is possible through controlled tuning of junction and wire properties, though superconductors require extremely low temperatures, creating deployment challenges.

  • Imec targets adoption by foundries, hyperscalers, and system companies, signaling a gradual integration into broader computing infrastructure.

  • Circuits were built with NbTiN across three metal layers, with the smallest Josephson junctions at 150 nanometers, enabling higher computing density and potential energy efficiency over CMOS.

  • Imec presented a world-first superconducting circuit featuring 3.8 million Josephson junctions in one square centimeter, unveiled at the 2026 Applied Superconductivity Conference.

  • The report highlights potential for large energy savings and performance gains in future data centers and HPC systems from ultra-dense superconducting circuitry and ultra-narrow wiring.

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