Apple's COO Jeff Williams visited TSMC in Taiwan to secure early access to 2-nanometer production capacity.

This move is aimed at enhancing Apple's M-series chips and AI capabilities, particularly for AI server development in iOS 18.

Apple has heavily invested in generative AI research and development.

Currently, Apple utilizes TSMC's 3-nanometer process for its M4 SoC.

Apple plans to release three new versions of the M4 chip to boost AI processing power, with mass production starting in the second half of 2024.

The collaboration with TSMC could significantly increase the chipmaker's annual revenue.

Both Apple and TSMC have not disclosed specifics about Williams' visit.