Teledyne FLIR OEM announced the launch of the Boson+ IQ Development Kit at DSEI UK 2025, a comprehensive thermal imaging solution designed for rapid development of edge AI capabilities.

The kit will be showcased at Teledyne FLIR's booth (#S3-110) at ExCeL London during the event from September 9 to 12.

By integrating the Boson+ thermal camera with Prism AI and ISP software on a Qualcomm platform, the development kit promises faster development cycles, improved image quality, and longer mission endurance with minimal power consumption.

Built for scalability and future compatibility, the kit supports upcoming features like Prism SKR for autonomous target detection and Prism Supervisor for autonomous navigation, enhancing its capabilities in complex environments.

Designed to be future-proof, the kit ensures seamless integration with future software updates, making it suitable for mission-critical applications.

A key feature is the Teledyne FLIR OEM AVP, powered by Qualcomm's Dragonwing QCS8550 SoC, capable of 50 TOPS at only 2.5 watts, supporting advanced AI object detection and image processing.

The development kit includes reference hardware, Prism software, SDKs, interface control documentation, and engineering support, ensuring a smooth transition from prototype to deployment.

Attendees and interested parties can visit Teledyne FLIR OEM at Stand #S3-110 during DSEI UK 2025 to learn more about this innovative thermal AI development platform.

It includes interface and carrier boards with three MIPI interfaces, along with SDKs, hardware documentation, and engineering support to facilitate sensor integration and development.

The solution aims to assist system integrators in developing edge AI for defense, security, and industrial applications, including autonomous systems like drones and ground robots.

Teledyne FLIR promotes the kit as a significant advancement for building smarter thermal systems in autonomous drones, ground robotics, and other mission-critical platforms, enabling more efficient AI-powered thermal solutions.