DEEPX Unveils Revolutionary DX-M1 Chip at Japan IT Week 2026, Eyes Major Expansion in Telecom & Manufacturing
April 13, 2026
DEEPX is positioning itself as a top contender in Japan’s telecom and manufacturing arenas, aiming to broaden adoption of its edge AI solutions through local trading partners and KITA initiatives.
Led by CEO Lokwon Kim, DEEPX demonstrated its mass-produced DX-M1 chip at Japan IT Week 2026 in Tokyo, signaling an accelerated push to expand in the Japanese market.
The event drew interest from major Japanese distributors and industry stakeholders, with several distributors planning follow-up meetings to promote DX-M1 adoption.
The new module targets reduced cloud reliance and faster on-device AI for robotics, smart cities, and industrial automation, boosting on-site responsiveness.
This expansion taps growing demand for physical AI—embedding AI directly into robots, cameras, and factory equipment while meeting tight power and heat constraints.
The module is built around DEEPX’s DX-M1 chip, already in mass production, optimized for high-performance, ultra-low-power real-time on-device inference.
MSI showcased an AI Box for parking management powered by the DX-M1 M.2 module, riding on the buzz from Computex Taiwan.
Sanshin demonstrated Edge AI and IoT cameras using DEEPX technology at the SORACOM booth, illustrating real-world deployment scenarios.
The summary comes from a DEEPX press release dated for Japan IT Week 2026 coverage.
Japan has shown strong interest in DeepX due to its power efficiency and compact design, with about 30 companies planning follow-up discussions during the event.
Summary based on 8 sources
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Sources

PR Newswire APAC • Apr 13, 2026
DEEPX Showcases Physical AI Ecosystem with Partners at Japan IT Week 2026, Spearheading Korea-Japan AI Cooperation

