QCT and NVIDIA Unveil AI-Infrastructure Innovations at OCP 2026 Summit to Revolutionize AI Workloads

October 12, 2026
QCT and NVIDIA Unveil AI-Infrastructure Innovations at OCP 2026 Summit to Revolutionize AI Workloads
  • At the 2026 OCP Global Summit, QCT unveils co-designed AI-infrastructure offerings powered by NVIDIA technologies, including the Vera Rubin POD, ARC-Pro platform, and AI factory digital twins built with NVIDIA DSX blueprint.

  • Supporting servers extend the ecosystem with CPU-focused units such as the liquid-cooled QuantaPlex T46X-1U and the air-cooled QuantaGrid D66Q-2U to boost throughput and responsiveness for AI workloads.

  • The NVIDIA Vera Rubin POD unifies five rack-scale systems into a single AI factory platform, featuring 72 NVIDIA Rubin GPUs and 36 NVIDIA Vera CPUs across 18 QuantaGrid D76V-1U trays, with up to 20.7 TB of HBM4 memory for large-scale training and inference.

  • Early customers include Meta and CoreWeave, with Amazon Web Services also lined up to add Vera as a compute option for agentic workloads.

  • Vera is positioned to challenge CPU incumbents amid rising demand for agentic workloads, with Arm entering the enterprise CPU race.

  • Google Falcon Transport support was announced for future ConnectX-10 SuperNICs and BlueField DPUs to improve network efficiency and interoperability with Google’s data center transport.

  • Google and NVIDIA jointly announced Falcon Transport support on future ConnectX-10 SuperNICs and BlueField DPUs to enable efficient, interoperable networking across Google data centers using DOCA software.

  • The company markets an edge-to-data-center distributed AI infrastructure as a path to faster deployment, lower latency, and improved token-per-watt efficiency for agentic and generative AI applications.

  • Open standards and open-source components were released to accelerate AI factory deployment, efficiency and scalability, including MGX 1.2 and DSX AI Factory components.

  • NVIDIA and Cisco introduced the Ultra-Dense Small Form Factor Pluggable (USFP) to scale 400 Gb/s networking with higher energy efficiency, with collaboration across the ecosystem for cages, connectors and modules.

  • USFP is a 400 Gb/s-per-lane pluggable optic form factor to boost bandwidth density and power efficiency, developed with industry collaboration for interoperability.

  • A Vera CPU rack is described as a discrete system adjacent to an NVL72, freeing cores for agentic workloads.

Summary based on 10 sources


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