Bigscreen announced its new headset, the Beyond 2, in March 2025, with initial shipping planned for April and May.

However, the shipping of the first batches has been delayed to June 2025 due to a design flaw in the headset.

This design flaw involves a printed circuit board (PCB) that affects controller tracking, an issue identified by testers before it was confirmed.

As a result, Bigscreen produced 5,000 flawed PCBs that now need to be scrapped, further contributing to the shipping delay.

To address the tracking issue, Bigscreen received assistance from Valve, implementing improvements from the Valve Index.

In an effort to maintain quality while scaling up production, Bigscreen is utilizing computer vision technology to inspect components and minimize defects.

Additionally, the overseas manufacturer has ramped up production by running double shifts overnight to meet demand.

To support this increased production, Bigscreen has hired 11 new employees for its Los Angeles assembly factory and customer support team.

The delay primarily affects the first buyers, whose orders sold out rapidly within hours of opening.

If production accelerates as planned, Bigscreen hopes to ship the first Beyond 2 batch by the end of May 2025.