Bigscreen's Beyond 2 VR Headset Delayed Due to PCB Flaw; Shipping Rescheduled to June 2025

April 28, 2025
Bigscreen's Beyond 2 VR Headset Delayed Due to PCB Flaw; Shipping Rescheduled to June 2025
  • Bigscreen is actively working to accelerate production and hopes to begin initial shipments by the end of May 2025 if all goes according to plan.

  • To meet the high demand for the headset, Bigscreen has hired 11 new employees for its Los Angeles assembly factory and customer support team.

  • Additionally, the overseas manufacturer has increased production capacity by running double shifts overnight.

  • In collaboration with Valve, Bigscreen is implementing improvements from the Valve Index to enhance the Beyond 2's controller tracking.

  • This partnership aims to improve the electronics of the headset, enhancing tracking precision.

  • This delay impacts only the first buyers, whose orders sold out rapidly within hours of opening.

  • Bigscreen recently announced a delay in the delivery of its highly anticipated Beyond 2 PC VR headset, originally set to ship in April and May 2025, due to technical issues identified during production.

  • As a result of these issues, orders that were scheduled for delivery in April and May are now rescheduled for June 2025.

  • Despite the setback, the Beyond 2 headset has seen a strong launch, with first-day orders matching the total sales of its predecessor over six months.

  • The delay is primarily attributed to a design flaw involving a printed circuit board (PCB) that affects controller tracking, which testers discovered before the issue was officially confirmed.

  • Over 5,000 flawed PCBs were produced, necessitating their scrapping and the need to rebuild them from scratch, further contributing to the shipping delay.

  • The Beyond 2 is notable for its lightweight design at 107 grams, which is 20 grams lighter than the original model, and features upgrades like adjustable eye relief and improved pancake lenses.

Summary based on 2 sources


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