India’s push to boost domestic chip making takes a major step forward as Cyient is selected for a pivotal role in a Rs 4,500-crore project to modernize a semiconductor fabrication facility in Mohali, Punjab.

Key technologies involved include RF‑CMOS, BCD (HVLDMOS), and CMOS Image Sensor, with design enablement and related activities guiding the upgrade.

Cyient Semiconductors’ strategy emphasizes smart energy semiconductors and ASICs, reinforcing its role as a leading domestic player in the semiconductor landscape.

Cyient announced the creation of Cyient Semiconductors Private Limited, a wholly owned subsidiary, to scale turnkey ASIC solutions and leverage Cyient’s design expertise.

Cyient will enable the SCL upgrade by supplying three core process technologies—RF‑CMOS, BCD HV‑LDMOS, and CIS—for broader high‑value silicon solutions in mature‑node capabilities.

The updated platforms are intended to strengthen India’s mature‑node semiconductor capabilities and extend relevance to industrial, automotive, energy, sensing, and connectivity applications.

Cyient’s engagement includes supplying and qualifying RF‑CMOS, BCD HV‑LDMOS, and CMOS Image Sensor technologies for SCL’s upgraded 8‑inch line, expanding the fab’s capabilities across multiple application areas.

The contract supports the government’s aim to expand domestic capabilities, reduce imports, and provide fabrication capacity for startups, academia, and strategic sectors, in line with the India Semiconductor Mission.

The project is framed as part of a broader strategic shift in India’s semiconductor ecosystem, with potential growth across strategic sectors.

Cyient’s leadership highlights engineering depth, an expanding IP portfolio, and commitment to India’s self‑reliant semiconductor objectives.

Statements from Cyient executives underscore pride in qualification progress and the link to the nation’s semiconductor self‑reliance goals.

The upgraded process platforms are designed to strengthen India’s mature‑node capabilities and broaden their use in industrial, automotive, energy, sensing, and connectivity applications.