SEMROM Raises €7.3M for Breakthrough 3D AI Chip Technology

January 30, 2024
SEMROM Raises €7.3M for Breakthrough 3D AI Chip Technology
  • German semiconductor company SEMRON has raised €7.3 million in seed funding to develop energy-efficient AI chips.

  • SEMRON's innovative CapRAM™ technology uses a three-dimensional chip design and variable capacitors, increasing energy efficiency by 20 times.

  • The company's chips support AI models 200-300 times larger than current capacities and are designed to run on mobile devices.

  • SEMRON's chips have demonstrated energy efficiencies of over 3,500 TOPS/W, significantly reducing energy consumption during AI training.

  • Despite being pre-product, SEMRON has secured a total of €17 million, with Join Capital leading the funding round and contributions from SquareOne, OTB Ventures, and others.

  • Funding will go towards hardware and compiler development, team expansion, and internationalization, with plans to quadruple its workforce by year-end.

  • SEMRON aims to decrease reliance on major chip developers and provide specialized solutions for AI, lowering costs and energy use.

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