SEMROM Raises €7.3M for Breakthrough 3D AI Chip Technology
January 30, 2024
German semiconductor company SEMRON has raised €7.3 million in seed funding to develop energy-efficient AI chips.
SEMRON's innovative CapRAM™ technology uses a three-dimensional chip design and variable capacitors, increasing energy efficiency by 20 times.
The company's chips support AI models 200-300 times larger than current capacities and are designed to run on mobile devices.
SEMRON's chips have demonstrated energy efficiencies of over 3,500 TOPS/W, significantly reducing energy consumption during AI training.
Despite being pre-product, SEMRON has secured a total of €17 million, with Join Capital leading the funding round and contributions from SquareOne, OTB Ventures, and others.
Funding will go towards hardware and compiler development, team expansion, and internationalization, with plans to quadruple its workforce by year-end.
SEMRON aims to decrease reliance on major chip developers and provide specialized solutions for AI, lowering costs and energy use.
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