The G300K, a 248 nm KrF laser designed for high power, high repetition rate, and long-life modular reliability, targets micro-via holes 10 micrometers or smaller and trench patterning to support 2.5D/3D packaging using chiplets for AI chipsets.

Gigaphoton, founded in 2000, has a long-standing role as a global lightsource manufacturer providing end-to-end support for semiconductor manufacturers, from R&D to maintenance.

The company emphasizes its comprehensive lifecycle support for customers worldwide, spanning research and development to ongoing maintenance services.

Gigaphoton Inc. has delivered and installed its advanced G300K KrF excimer laser system for ultra-fine ablation processing in semiconductor advanced packaging at a Japanese company, with installation completed in November 2025.

Interested parties can contact Gigaphoton’s Media/Corporate Planning Department at [email protected] for inquiries.

CEO Tatsuo Enami states that Gigaphoton is expanding R&D to apply excimer lasers beyond lithography, pursuing new fields to advance advanced packaging processes.

Enami highlights ongoing efforts to broaden excimer laser applications beyond traditional lithography, aiming to unlock broader use in the industry.

The G300K is integrated into equipment from ORC Manufacturing Co., Ltd. and is positioned to enable 2.5D/3D packaging using chiplets, with a focus on AI chipsets.

The laser operates at 248 nm, delivering high power and high repetition rate with long-life modules, optimized for micro-via holes 10 micrometers in diameter or smaller and trench patterning.

Gigaphoton is presented as a critical lightsource manufacturer and is actively pursuing broader applications for excimer laser technology.

Results from using the G300K will be showcased at SEMICON Japan 2025, which runs from December 17, 2025, highlighting the processing outputs achieved.

Gigaphoton will present its G300K results and outputs at SEMICON Japan 2025, including the integrated ORC Manufacturing setup, starting December 17, 2025.