Onto Innovation Inc. received SK hynix's Best Partner Award for technology achievement on September 28, 2026, in recognition of its defect prevention system and breakthrough measurement technology for high-bandwidth memory applications.

The award underscores Onto Innovations contribution to SK hynixs HBM roadmap and its role in enabling reliable HBM manufacturing amid growing AI infrastructure needs.

Onto Innovation was the sole company honored for technology achievement at SK hynixs 25th Anniversary Partners Day, highlighting its central role in the HBM roadmap during a period of rising AI demand.

The press release includes forward-looking statements about market needs and potential risks, accompanied by the customary cautionary language aligned with the Private Securities Litigation Reform Act and the companys Form 10-K.

Onto Innovation offers a broad portfolio across the semiconductor value chain, including 3D metrology, macro defect inspection, and lithography for advanced packaging, with a focus on yield improvement and reliability.

The companys capabilities span un-patterned wafer quality, 3D metrology, macro defect inspection, metal interconnect analysis, factory analytics, and lithography for advanced semiconductor packaging.

The Dragonfly G5 inspection system is highlighted as enabling process-control insights to identify critical defects earlier, reducing yield risk in HBM manufacturing.

The award and collaboration emphasize Dragonfly G5s capabilities in improving defect detection and process control across thinning, bonding, and assembly stages of HBM production.

The release provides additional information about Onto Innovation and its offerings, including a forward-looking statements disclaimer and investor relations contact details.

HBM demand is expanding due to AI applications, with TrendForce forecasting more than 50% growth by 2027 and the industry moving toward 12- and 16-high HBM stacks, increasing inspection complexity and the importance of early defect detection.

SK hynix aims to expand HBM capacity to meet AI demand, with TrendForce forecasting over 50% growth by 2027.

Industry context notes that AI-driven demand is boosting HBM capacity needs; TrendForce projects over 50% growth in AI-related memory demand by 2027, driving adoption of advanced HBM generations.