SK Hynix's HBM chips, crucial for AI chipsets, are sold out for 2023 and nearly for 2025, underscoring a surge in demand.

The company is supplying Nvidia and will introduce its advanced 12-layer HBM3E chip samples in May.

SK Hynix's investment includes $3.87 billion for a new chip packaging facility in Indiana focusing on HBM chips, and 5.3 trillion won for a new domestic DRAM factory prioritizing HBM production.

U.S. competitor Micron also reports its HBM chips are sold out for 2024, reflecting industry-wide demand growth.

Samsung Electronics is preparing to produce its version of the 12-layer HBM3E chips.

By 2028, AI-oriented chips are expected to comprise a significant segment of the total memory volume.