Designed for a wide temperature range and rugged use, the IQ-X is positioned for industrial PCs in automation and robotics contexts.

The processors are designed for harsh environments with -40°C to 105°C range using ARM architecture.

The platform uses 8 to 12 Qualcomm Oryon performance cores and supports Windows 11 IoT Enterprise LTSC for enterprise workflows.

Qualcomm unveiled the Dragonwing IQ-X family, its first industrial PC processor line built on the Oryon architecture, delivering up to 45 TOPS of AI compute for edge AI in factory automation and smart manufacturing.

The IQ-X silicon combines a 4nm Oryon CPU with 8 to 12 high-performance cores and an integrated NPU to run on-device AI workloads like predictive maintenance, condition monitoring, and defect detection.

Key specifications include an industrial temperature range of -40°C to 105°C and rugged packaging designed for harsh industrial environments.

Qualcomm emphasizes long product life-cycle support, enhanced security features, and strong connectivity to meet industrial use-case demands.

Industry impact is expected to be significant: smarter factories could improve supply chain predictability, reduce downtime, raise quality, and propagate benefits to consumer devices and systems.

The architecture leverages Qualcomm’s Oryon cores with an Hexagon NPU offering up to 45 TOPS to detect defects and irregularities in manufacturing through AI.

The platform targets demanding environments with operation across extreme temperatures, suitable for hot factory floors.

A lightweight reference device, Arduino Uno Q, is mentioned for price comparison, highlighting an ecosystem emphasis around embedded/edge solutions.

IQ-X aims to reduce OEM/ODM time-to-market and complexity by enabling upgrades via standard plug-in modules without redesigning hardware.

The solution is built for harsh industrial settings with rugged packaging, broad peripheral support, and deployment flexibility across PLCs and edge controllers.

It emphasizes compatibility with industry-standard COM module form factors to enable easy integration and drop-in replacement on existing carrier boards.

The deployment model envisions long-term partnerships, with multi-year engagements and extended refresh cycles compared with consumer markets.

Qualcomm hosted a Snapdragon X Architecture Deep Dive in San Diego, signaling deeper engagement with press and partners.

IQ-X is designed for rapid customization and scalability to reduce BOMs and time-to-market for factory automation, robotics, and intelligent edge deployments.

The platform supports industrial-grade temperature ranges, drop-in compatibility with common Computer-on-Module form factors, and provides an evaluation kit for scalable deployment.

With up to 45 TOPS AI performance, the IQ-X highlights strong NPU capabilities for real-time, edge AI tasks.

Qualcomm presents IQ-X as a ready-made, AI-friendly platform to scale intelligent factory solutions from existing starting points.

Compared to consumer lines, Dragonwing IQ-X raises maximum operating temperature to -40°C to 105°C due to packaging adjustments.

Local AI acceleration up to 45 TOPS enables multi-dimensional sensor data analysis at the edge.

Core features include strong single- and multi-thread performance, rugged packaging, extensive peripheral support, multimedia capabilities, and power efficiency.

The processor is built on a 4nm process, includes an integrated NPU to run AI frameworks at the edge, and supports Windows 11 IoT, Qt, CODESYS, and EtherCAT.

In summary, Dragonwing IQ-X combines ARM-based Oryon cores and NPU with enterprise-friendly software support for industrial deployment.

Qualcomm has not announced an exact launch date; first products are expected in the coming months.

Industrial applications envisioned include predictive maintenance, condition-based monitoring, and broader intelligent edge deployments in factory automation and robotics.

Notebookcheck coverage by Silvio Werner, dated November 13, 2025, notes the journalist’s focus on mini-PCs and single-board computers in this Qualcomm showpiece.

Software and toolchains include Windows 11 IoT Enterprise LTSC, Qt, Codesys, EtherCAT, with ONNX and PyTorch runtimes via the Qualcomm AI Software Stack for edge AI.

The IQ-X supports Windows 11 IoT Enterprise LTSC and aims for compatibility with industry-standard embedded modules to replace carrier boards and cut BOM costs.

It enables reuse of existing Windows software stacks and industrial protocols on AI-capable, power-efficient edge modules.

Adoption is led by major OEMs and ODMs, including Advantech, Congatec, Kontron, Nexcom, Portwell, Seco, Tria, with commercial devices expected to roll out soon.

Initial adopters include the above companies, signaling a broad industrial roll-out in the coming months.

German-language confirmation notes that first Dragonwing IQ-X devices are anticipated to appear by the near future as manufacturers start shipping.

Qualcomm’s stack integrates with ONNX and PyTorch to bring NPU-accelerated AI to industrial hardware for real-time edge inference.

The IQ-X family offers Compute Module compatibility with existing carrier boards and plans an Evaluation Kit to support early pilot studies.

An evaluation kit will accompany the rollout to assist early implementation and testing across projects.

Overall, Dragonwing IQ-X is framed as a strategic move to embed modern computing into industrial environments, accelerating a broader digital transformation in manufacturing.