TSMC plans trial production of sub-1nm chips by 2029, positioning the move beyond the 1.4nm A14 node slated for 2028.

TSMC’s 1.4nm A14 path at Tainan’s A10 facility is highlighted as a likely route, with Apple potentially an early adopter and an initial 5,000-wafer trial.

The roadmap underscores continued importance of 1.4nm and 1.6nm (A16) steps before sub-1nm becomes viable for MacBook and iPhone, implying multiple transitional nodes.

A broader timeline shows sub-1nm chips following 1.4nm, but acknowledges high costs, yield risks, and other challenges that could affect timing.

DigiTimes notes a suggested transition to 2nm chips for the iPhone 18 Pro lineup launching in September, with TSMC manufacturing.

Apple is reportedly targeting 1.4-nm fabrication for future iPhones, with trial production around 2029 and mass production in the following decade.

Apple is identified as the primary potential adopter, likely willing to pay a premium for sub-1nm chips and could use its scale to secure exclusivity.

Industry context highlights rising AI demand and potential 2nm yield challenges that may push Apple and peers toward bleeding-edge nodes, while noting significant technical hurdles for 1.4nm and 1.6nm processes.

Regardless of timing, the push toward smaller nodes is framed as necessary to meet AI-era requirements, with uncertainty about when sub-1nm chips will appear in iPhones and Macs.

The sub-1nm initiative would leverage TSMC’s Tainan facilities (A10 and P1-P4) to target an initial output of about 5,000 wafers per month.