India advances its semiconductor strategy with a $3.3 billion tripartite deal among the Odisha government, Intel, and 3D Glass Solutions to build an advanced packaging glass-core substrate facility in Bhubaneswar-Khurda, Odisha.

The MoU marks an initial step in a multi-year process; final plant delivery will require approvals, funding arrangements, and possible project adjustments over a five-to-six-year horizon.

The project is planned to roll out over five to six years in phases, creating more than 1,800 direct high-skilled jobs and stimulating indirect employment across the electronics and semiconductor supply chain.

Substrates, especially glass-core substrates, are a critical missing link in India's semiconductor value chain, making this project strategically significant for the ecosystem.

The facility will manufacture advanced packaging glass-core and high-density interconnect substrates, with Intel contributing technology expertise and process support to enable next-generation packaging capabilities.

The investment is contingent on regulatory approvals, potential central and state government funding, and other business conditions.

Vaishnaw outlined a broader roadmap, noting four semiconductor plants expected to be ready by 2026, with two more planned for 2027 and an operation-ready unit in Dholera by 2028.

Target production includes about 70,000 glass substrates per year, around 50 million assembled units, and roughly 13,000 advanced 3D heterogeneous-integration modules.

The initiative focuses on glass-core substrates, high-density interconnect substrates, and related semiconductor technologies.

The broader roadmap envisions India becoming a top-six semiconductor nation by 2032 and among the top three by 2047, supported by investments in machinery, chemicals, gases, and testing infrastructure.

The move reflects a global trend toward localized chip supply chains, echoing the EU and US efforts to regionalize semiconductor ecosystems.