India’s roadmap for semiconductors envisions investments of roughly $135–180 billion over the next decade to build a globally competitive ecosystem spanning design, fabrication, advanced packaging, materials, and infrastructure.

The report recommends the government fund at least one-third of these investments to lower risks and boost investor confidence.

Four policy imperatives drive the roadmap: blended-capital mobilization with export incentives, a streamlined regulatory framework with single-window clearances and strong IP protection, a critical minerals strategy for secure access to SiC, GaN, cobalt, and lithium, and strategic alliances with the US, Japan, Taiwan, and the EU for technology transfer and supply-chain integration.

The plan rests on five strategic pillars: Pioneering R&D, Policy & Investment, Production, People, and Partnership, designed to address capital intensity, skill gaps, and long gestation.

A detailed five-pillar roadmap outlines the same pillars: Pioneering, Policy & Investment, Production, People, and Partnership.

Core recommendations include building domestic capabilities through sovereign EDA access, a robust talent pipeline, and expanded trusted partnerships with the US, Japan, and Europe.

Targets aim for 15–25% local demand self-sufficiency by 2030 and 35–50% by 2035, with broader value-chain self-sufficiency goals of 35–40% by 2030 and 55–70% by 2035.

Strategic takeaways stress aligning investments with incentives and mineral security, prioritizing advanced packaging and compound semiconductors, building trusted global partnerships, and sustaining talent pipelines to scale responsibly.

The production strategy focuses on selective depth in manufacturing—targeting mature nodes and SG markets—while exploring wide-bandgap materials like SiC and GaN and possibly power sources to support fabrication clusters.

Initiatives under these pillars include tiered EDA subsidies, a National Design and Packaging Co-Design Platform, and an AI-enabled Semiconductor Engineering Mission to strengthen capability and collaboration.

The incentives framework should move to a tiered, value-chain-wide model, replacing fragmented schemes and linking benefits to outcomes like capacity, yield, localization, and exports.

A holistic incentives approach ties capital intensity, technology risk, and strategic importance to predictable, long-term support.