QTREX Quantum announced a breakthrough in cryogenic chip carrier production using its single-build Additively Manufactured Electronics (AME) process, based on a design from a major U.S. quantum tech company.

The carrier employs a Kapton-class polyimide substrate engineered for extreme low-temperature stability, enabling monolithic deposition of conductive pathways, shielding, and dielectric transitions without traditional discrete connectors.

CEO Dagi Ben-Noon said the development broadens QTREX’s quantum connectivity platform to include processor-interface functions.

The announcement was published on June 18, 2026.

The release notes forward-looking statements and provides media and investor relations contact details.

Investors have responded positively, with QTREX stock up about 154% over the past year and 111% year-to-date; analysts suggest the stock trades below fair value, signaling upside.

QTREX’s corporate release with technical specifications is accessible via the Investors Index, and a GlobeNewswire release dated June 18, 2026, outlines expansion into quantum processor interfaces.

Recent developments include regaining Nasdaq compliance, receiving roughly $1 million Israel Innovation Authority grant for dielectric materials for high-density, low-loss RF routing in scalable superconducting quantum systems, securing a Fortune 500 purchase order for the AME system, and a $10 million private placement expected to close in 2026.

The company also disclosed a $10 million private placement and confirmation of Nasdaq compliance, alongside the grant and a Fortune 500 order.

QTREX plans to showcase the chip carrier sample at Quantum.Tech World 2026 in Boston, inviting industry participants to discuss designs and collaborations.

Specifically, private meetings in Boston during June 25–26, 2026 will feature the sample and discussions on processor-interface collaborations.