Technical approach involves doubling tin droplet rate to about 100,000 per second and using a dual-pulse laser to shape plasma, yielding higher power while maintaining manufacturing practicality.

The upgrade is expected to lower chip production costs and shorten time-to-market, with projected throughput rising toward about 330 wafers per hour per EUV machine by 2030, up from roughly 220 today.

Industry risks include cyclicality of semiconductors, rapid tech change, and higher stock volatility, warranting close monitoring of insider activity and market sentiment.

The development reinforces Europe’s strategic role in the global supply chain amid geopolitical emphasis on semiconductor independence and resilience.

ASML announces a breakthrough to boost EUV light source power to 1,000 watts, aiming to lift chip output by up to 50% by 2030, with a clear path suggested toward 1,500 watts and potentially 2,000 watts in the future.

Executives describe the system as production-ready rather than a mere demonstration, indicating practical deployment conditions and potential to lower chip costs.

The breakthrough is framed as a practical step to reduce wafer exposure time, enabling higher throughput and supporting AI-focused chip demand from major customers like TSMC, Intel, and Samsung.

Valuation signals a premium for ASML, with high P/E, P/S and P/B ratios, and a market RSI suggesting potential overbought conditions amid strong but cautious investor sentiment.

Industry figures stress the importance and challenge of mastering EUV technologies, underscoring the breakthrough’s significance.

Executives highlight reduced exposure times and lower costs per chip as key benefits, reinforcing ASML’s leadership against rivals and export controls in a geopolitically charged market.

ASML remains dominant in the global lithography market with roughly a 90% share and major clients like TSMC, Samsung, and Intel, while outsourcing most manufacturing.

ASML’s financial health is underscored by favorable Altman Z-Score and Piotroski F-Score, signaling robust liquidity and low risk of distress.